Syswin Solutions – Coordinator of the Components Assembly and Interconnection through Combined Solderless Technologies ( COMPACT) project submitted through the MANUNET ERA-NET Call 2018 Program

Syswin Solutions – Coordinator of Component Assembly and Interconnection through the Combined Solderless Technologies (COMPACT) project, presented through the MANUNET ERA-NET Call 2018 Program, announces that it has passed the evaluation procedure and is proposed for funding.

Partners in the project are: University POLITEHNICA of Bucharest – Center for Technological Electronics and Interconnection Techniques (UPB – CETTI) and TacticaTIC Company from Spain.

The duration of the project is 24 months from 2020.